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BD1604MUV, BD1604MVV
Technical Note
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Not connecting input terminals
In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. Unstable state
occurs from the inside gate voltage of p-channel or n-channel transistor into active. As a result, power supply current
may increase. And unstable state can also cause unexpected operation of IC. So unless otherwise specified, input
terminals not being used should be connected to the power supply or GND line.
(13) Thermal shutdown circuit (TSD)
When junction temperatures become setting temperature or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as
possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this
circuit operating or use the LSI assuming its operation.
(14) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
● Thermal Loss
The following conditions must be met for thermal design. (Because the following temperature is only the assured
temperature, be sure to consider the margin for design.)
1. The ambient temperature Ta must be 85 ? C.
2. The IC loss must be smaller than an allowable loss (Pd).
● Power dissipation character
The following shows the power dissipation character.
1
1
0.8
0.6
0.4
0.2
0
0.78W
0.8
0.6
0.4
0.2
0
0.70W
0
25
50
75
100
125
150
0
25
50
75
100
125
150
TEMPARATURE[ ℃ ]
Fig.19 BD1604MVV
TEMPARATURE[ ℃ ]
Fig.20 BD1604MUV
Mount board specification
Material : Glass epoxy
Size : 70mm × 70mm × 1.6mm
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9/10
2011.06 - Rev.B
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